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Care must be taken to ensure solvent compatibility with the OSP coating and its impact on the coating s ability to protect the copper after cleaning Another deficiency of OSP-Cu is found at in-circuit test (ICT) As the board is passed through top- and bottom-side reflow cycles and wave soldering, the unsoldered and unfluxed test points build up a layer of copper oxide This oxide layer is difficult to pierce even with sharp pin- or blade-type ICT probes, resulting in open circuits and multiple fixture reseatings to attain probe penetration and electrical contact Some have adopted coating the test points with solder; however, no-clean residues can also lead to ICT probe contact problems The best strategy goes against modern PCA practices: reverting to the use of water-clean solder paste and wave solder flux and coating test points with solder paste.

The post-soldering, aqueous cleaning cycle removes any flux residues, enhancing ICT probe contact on solder-coated test point on the finished PCA Most large electronic manufacturers have worked diligently to remove aqueous cleaning from their factories a move for improved process economics and significant environmental impact Therefore, OSP-Cu is best used where ICT is not required, such as on low-end consumer products 4563 Electrolytic Nickel/Electrolytic Gold This plating combination has been in use for many years and is considered a high-end surface finish but a highly reliable one in terms of solderability and product life The amount of gold (Au) is small, but the plating process uses toxic and expensive materials that further increase the price of the plating This plating system should not be confused with electroless nickel/immersion gold (ENIG) That surface finish will be discussed separately and does not have the reliable history of electrolytic nickel/electrolytic gold.

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The electroplated nickel (Ni) serves as a barrier between the copper and the gold Ni on its own is a poor candidate for a solder pad coating as it oxidizes rapidly and its native oxide is very stable chemically tough to dissolve or react away Unoxidized Ni can alloy with tin, which means that it can be soldered Were the gold deposited over the copper directly, the gold layer would begin to interdiffuse with the copper even at room temperature forming an.

intermetallic compound The reaction rate is temperature-dependent This intermetallic, like most intermetallic compounds, is difficult to solder, requiring a higher process temperature, a more active fluxing agent, or both The Au-Cu system has poor solderability and the brittleness of this intermetallic results in diminished solder-joint strength Ni-Au coatings are in widespread use worldwide Ni coating thickness is generally on the order of 254 mm (>100 min) Au is a more difficult metal to plate It tends to coalesce into islets, resulting in a porous coating Any pores in the gold overcoat allow oxidation of the underlying Ni, rendering it locally unsolderable To preclude this, the gold is liberally plated with a targeted minimum thickness greater than about 0127 mm (5 min) to ensure complete Ni coverage There are problems with the Ni-Au metallurgical system First and foremost, it is well known that gold can cause solder joint embrittlement.

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When gold is introduced to tin as in tinlead solder, it forms alloys with both the Pb and Sn The Au-Pb alloy has two predominant intermetallic compounds: Au2Pb and AuPb2 Of the two, the latter is of greatest concern It begins to form at the Au-Pb eutectic (85 wt percent Pb, mp, 215 C), a temperature that encroaches into the normal reflow solder processing regime AuPb2 is stable below 254 C and is characterized by brittle, plate-like structures Regardless of the composition, size, and concentration of the intermetallic grains in the solder joint, they can either strengthen it (forming miniature reinforcing bars in a solder cement ) or they can embrittle it, detracting from the solder s inherent ductility Gold is non-oxidizing, like platinum and palladium, its noble metal neighbors in the periodic table It readily alloys with most common solder alloy compositions, especially Sn-Pb and Sn-Ag-Cu A.

compiler: A software program that converts a high-level language source code into the machine language that the processor can execute counter: A register that is incremented for each occurrence of an event on an input pin of the counter The event is indicated by a pulse For each pulse, the counter is incremented by one critical section: A chunk of code that must be executed without any interruption for proper operation CPLD: Acronym for Complex Programmable Logic Device A programmable logic device rich in gates and interconnection circuitry CPU: Acronym for Central Processing Unit The CPU is the computational and control unit of a computer DAC: Acronym for Digital to Analog Converter A device or a process that converts a digital number to a corresponding analog voltage or current data bus: A set of signals that carries the data information between the processor and the memory and/or I/O devices.

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