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Another pitfall of Cu-Au or Cu-Au-Sn systems is that of Kirkendall void formation Pores in the solder joint or at copper-gold interfaces occur through solid-state diffusion Copper, which has a relatively high solubility and solid-state mobility in gold, diffuses into the gold Transported by grain boundary diffusion at temperatures below 150 C and by bulk diffusion above that temperature, Au-Sn regions result along with atomic vacancies When lattice vacancies are in profusion, voids can be observed, and this material depletion weakens the solder joint Several references are available on this phenomenon25,26,27,28 Kirkendall voids should in no way be confused with voiding that results from entrapped gases, liquids, or residues from solder paste in the surface-mount process or from fluxes or from PWB laminate materials in wave soldering.

Although there is still much controversy on the subject of Au concentrations and effects on the solder joint, there is no doubt that this metal system is being widely exploited successfully in electronics manufacturing It is, however, prudent to ensure that the Au levels are kept to a minimum via adequate vendor management and implementation of good process control methods for solder deposition Note that because gold is a non-oxidizing material and therefore does not deplete the flux, more flux is available to work on the other components of the metallurgical system namely, the underlying nickel (which must be kept from oxidizing), the solder, and the component lead The Ni-Sn intermetallic is more brittle than that of Cu-Sn, and this surface finish is generally not recommended for applications where the product may experience high mechanical stresses such as shock or vibration.

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debug: To correct mistakes in a program debugger: A software program that assists in debugging a piece of code development host: A computer system that hosts development software like an assembler, compiler, programmer, debugger, etc dongle: A mechanism to ensure that only authorized users can use a particular software with the help of an electronic lock provided with the software to deter software piracy The dongle needs to be connected to the PC parallel port, serial port, or the USB to be able to use the software duplex: Term used in communication systems that means that both the transmitter and the receiver can send and receive signals at the same time embedded controller: A piece of hardware including some processor and software that controls a device emulator: A device that mimics the behavior and functions of another device A processor emulator EMI: Acronym for Electro-Magnetic Interference.

h = 0001 in (Maximum load) Inflow Resistance, Ri Outflow Resistance, Ro The Resistance Ratio, z Pocket Pressure, PR Virtual Bearing Area, Av Hydrostatic Thrust, T Bearing Stiffness, dT/dh Volumetric flow, Q Total pumping power, Pp Friction force, FL Friction Power, Pf Temperature Rise, T 553 lbf s in 5 4420 lbf s in 5 0125 200 lbf in 2 535 in2 10700 lbf 357 106 lbf in 1 0045 in3 s 1 00154 hp 159 lbf 012 hp 117 deg F h = hd = 0002 in (Design condition) 553 lbf s in 5 553 lbf s in 5 1000 112 lbf in 2 535 in2 6020 lbf 451 106 lbf in 1 0203 in3 s 1 007 hp 795 lbf 06 14 deg F h = 0004 in (Minimum load) 553 lbf s in 5 69 lbf s in 5 8000 25 lbf in 2 535 in2 1340 lbf 892 105 lbf in 1 0362 in3 s 1 012 hp 397 lbf 03 hp 5 deg F

It has been stated that in the Ni/Au system, the soldering actually occurs on the Ni surface and the Au serves as a protective coating Another intermetallic of this system, NiSn3, has been cited as a problem in long-term solderability degradation29 This IMC rapidly develops a platelet structure at low temperatures, with the greatest growth rate in the vicinity of 100 to 140 C When intermetallic platelets grow large enough, they may penetrate the surface of the overlying tin, oxidize, and become a material difficult to flux and solder The presence of elemental Pb was determined to retard NiSn3 IMC formation Ni/Au surface finish is in use with Pb-free soldering, but there is currently a watch in the industry as sporadic brittle fracture has been observed on occasion.

The exact nature of this fracture mechanism is yet to be understood and it is not certain that Ni/Au surface finish is at fault or just coincidental with some failures 4564 Electroless Nickel/Immersion Gold (ENIG) As the name implies, ENIG is not an electroplated surface finish Still comprised of Ni with an overcoat of Au, ENIG is a lower-cost alternative than electrolytic Ni/Au When the plating process is kept in control, it gives an excellent, solderable, and reliable surface finish On the other hand, it is a finish that has caused many well-known reliability problems Terms such as black-pad, black line nickel, and mud cracks describe some of the evidence of failed ENIG-related problems Although these phenomena are most commonly observed on BGA packages plated with ENIG for package-to-ball attachment,30 the failure has also been seen on solder joints on PWBs plated with an ENIG surface finish..

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