.net pdf 417

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The main defect is brittle failure of the solder joint a clean break beneath the intermetallic layer formed on the PWB bonding pad Were the package completely pried loose from the board, a high surface area, dull finish on bonding pad would be evident the wellknown black-pad Often the pad has an array of cracks visible on its surface reminiscent of mud cracks Once the failed component is removed, the black-pad afflicted bonding pads is unsolderable or unreliable for further use and the board must be scrapped Although the exact cause of ENIG failure is not well understood, it seems to be linked to low phosphorus concentration in the electroless nickel plating bath ENIG s appeal is its modest cost, flat topography consistent with all plated surface finishes, excellent solderability, excellent testability, and reasonable shelf-life if plated well.

Unfortunately, the risk associated with this surface finish must be weighed alongside its benefits In general, the assembler will find good results with ENIG Unfortunately, there are no quick screening methods to weed out failure-prone ENIG plating lots 4565 Immersion Silver (Imm-Ag) This electroless silver-plated surface finish is in common use for Pb d assembly and is also compatible with the most common Pb-free soldersAlthough it is highly solderable and known to be a good material for probe contact during in-circuit test measurement, it does bring with it some negative attributes It has reasonable storage shelf-life if stored properly (air-tight bags), but is known to combine with sulfur contaminants in the atmosphere and tarnish or sulfidize The silver sulfide is somewhat resistant to weak organic fluxes as used for no-clean soldering A new failure mechanism associated with this surface finish has been reported.

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volumetric flow This is understandable since an increase in clearance will increase the flow of the fluid into the gap

31,32,33 Referred to as planar microvoids or champagne voids, they are small voids in alignment atop the intermetallic layer of a solder-joint bond line (see Fig 454)..

FIGURE 45.4 Cross-sectional micrograph of SAC BGA solder ball bonded to a silver surface finished PWB bond pad. Planar voids are clearly evident in the section and in the magnified inset. Voids in close adjacency above the intermetallic layer and the BGA ball can significantly detract from the solder-joint strength. (Courtesy of Hewlett-Packard).

This is a phenomenon by which a device or a system can generate an electromagnetic field in the radio frequency spectrum with the potential to disrupt operation of other electronic components or systems in the vicinity EEPROM: Acronym for Electrically Erasable and Programmable Read Only Memory EPROM: Acronym for Electrically Programmable Read Only Memory finite state machine: A device that stores the status of something at a given time, with some inputs that can change the state and/or outputs flag: A bit used by a program to remember something or to convey binary information to another piece of program flash memory: A nonvolatile memory that can be erased and reprogrammed in units of memory called blocks The name flash memory means the memory cells can be erased in an electron tunneling process in a flash by removing an electronic charge from a floating gate associated with each memory cell.

Planar voids result in diminished bond strength and solder-joint fracture. This defect has been responsible for some product failures and recalls.The root cause of the microvoids is generally believed to be the result of volatile organics incorporated during Ag plating, but there also seems to be a correlation between Ag thickness and Cu topology on the bond pad.

FIGURE 45.5 Ionic contamination on a board surface can adsorb moisture from the atmosphere. If an electrical charge is present, silver from bond pads may corrode and electrochemically migrate, resulting in a short circuit between bond pads.

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