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The material chosen for the application of hydrostatic bearings must be able to support the contact force when the hydraulic pump is stopped Some other considerations that must be taken into account are high bearing pressures, high varying temperatures, dimensional stability for high-precision movement and non-reactive nature The materials can be basically classified into metals and non-metals Common materials include cast iron, durobar steel and high-strength sintered materials, whereas non-metallic materials such as phenolic resins, nylon and PTFE can suitably reinforce with fabric or other fibrous material The surface smoothness will influence the stiffness of the bearing A good surface finish will generally allow a higher stiffness with common Ra values ranging in between 16 and 25 m Normally, the pocket or recess area is formed by casting, Fig 663: A hydrostatic journal bearing manufactured in whereas the land and slideways are three rings and then assembled, thus lowering machined to the required flatness The the cost of circumferential pads [17] capillary restrictor can be easily prepared as precision-bore glass capillary tubing is available in the market for a wide range of sizes In the manufacturing of the hydrostatic journal bearings, a few approaches can be made: The pockets in the journal bearings can either be cast, milled or electrochemically machined Another approach is shown as Figure 663 where the bearing is manufactured in three rings This simplifies the manufacturing process as the end rings are similar and Group Technology (GT) principles are followed

Silver ions are known for their mobility in the presence of an electrical field (see Fig 455) Ionic residues on a board with silver-coated surface finish together with adsorbed moisture from the atmosphere can result in electrochemical migration and corrosion dendrites originating from any exposed, unalloyed silver platingThese dendrites are most commonly seen on the board surface but can also occur under solder mask If the dendrites are long enough, they may cause electrical shorting to one another or to adjacent traces Since the corrosion dendrites are very thin, they are poor electrical conductors If enough current is passed, the dendrites may fuse and the once-shorted circuit will become open again If moisture and contaminant conditions are right, corrosion dendrites may form again and result in an electrical short This cyclical growth-and-fuse phenomenon can complicate diagnosis of the source of the shorting Silver is an expensive metal.

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With its increased demand for solders (eg, Sn-Ag-Cu), it is expected to rise in price, making it economically less attractive 4566 Tin (Sn) Tin deposited directly over copper, whether by electrolytic or electroless methods, should be avoided except for low-end/low-cost, short-field-life products Sn alloys with copper, even at room temperature, form a brittle intermetallic compound, albeit slowly It has limited solderable shelf-life at room temperature and the Sn-Cu intermetallic can inhibit soldering and may result in incomplete solder wetting or solder joints of inferior strength For tin to be used effectively, an appropriate non-porous barrier metal, such as Ni, should be deposited between the Cu and the Sn Immersion Sn can be plated only as a very thin layer since its deposition is by a self-limiting replacement reaction.

When there is no more exposed Cu on the surface of the PWB during the surface-plating operation, Sn deposition will cease Therefore, it is impossible to plate enough Sn by this method to extend the solderable shelf-life or reduce the brittleness of the solder joint..

When fresh, tin has reasonable solderability, but also tends to oxidize quickly. There are two important phenomena that are associated with Sn platings: tin whiskers and tin pest. 45.6.6.1 Sn Whiskers. Not to be confused with corrosion dendrites, whiskers are crystallites (see Fig. 45.6) that grow from pure tin surfaces into free space whereas corrosion dendrites grow on ionic contaminated, hydrated surfaces between two charged conductors. Although whiskers have been studied since the 1940s, their root cause is yet to be fully understood.

FPGA: Acronym for Field Programmable Gate Array A large and dense programmable logic device FSM: Acronym for Finite State Machine..

The hybrid journal bearing is superior to both axial groove and circumferential groove hydrodynamic bearings when a dynamic loading is to be applied in widely varying radial directions The disadvantage of hybrid bearings is the same as for hydrostatic bearings It is normally necessary to provide auxiliary hydraulic equipments, effective filtration and flow control restrictors However, it is possible that a lower system pressure will suffice in view of the high overload capability

FIGURE 45.6 Scanning electron microscope (SEM) micrograph of Sn whiskers growing from a pure Sn surface.When whiskers break, they pose danger of shorting between fine-pitch conductors. Whiskers can also grow long enough to bridge to a nearby conductor. (Courtesy of H. Hsu, Mitac Corporation, ShunDe, China).

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